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multilayer pcb printer fr4 material blue mask gold platting multilayer pcb fabrication printed circuit board pcb

Name: multilayer pcb printer fr4 material blue mask gold platting multilayer pcb fabrication printed circuit board pcb
Brand: hengsheng
Price: 0.1 USD

Quality multilayer pcb printer fr4 material blue mask gold platting multilayer pcb fabrication printed circuit board pcb for sale

Brand Name : hengsheng

Model Number : HS6025

Certification : UL, ROHS,SGS,ISO9001

Place of Origin : china

MOQ : 1pcs

Price : USD 0.1-5/pcs

Payment Terms : T/T, Western Union,paypal

Supply Ability : 100000pcs per month

Delivery Time : 7-10 days

Packaging Details : 25kgs/carton, vacuumed packing

Finished : Gold platting

Board Thickness : 0.2-3.2mm

Copper Thickness : 1-3oz

Impedance Control : Yes

Layer Count : 2-20

Material : FR-4, FR-1, CEM-1, CEM-3

Min. Hole Size : 0.2mm

Min. Line Spacing : 0.075mm

Min. Line Width : 0.075mm

Shipping Way : DHL, FedEx, UPS, TNT, EMS

Silkscreen Color : White, Black, Yellow

Solder Mask Color : Green, Blue, White, Black, Red

Surface Finish : HASL, ENIG, OSP, Immersion Gold

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Process Capability And Checking Parameters(Hard Board)
NO	ITEM	Technical Capabilities
1	Layers	1-38L
2	Max.Board Size	1200*610mm
		48"*24"
3	Finished Board Thickness	0.2mm--10.0mm
		0.008"--0.4"
4	Finished Copper Thickness	17um-420um
		0.5OZ--12OZ
5	Min.Trace Width/Space	0.075mm/0.065mm
		0.003"/0.0026"
6	Min.Hole Size	0.15mm
		0.006"
7	Hole Dim. Tolerance(PTH)	±0.05mm
		±0.002"
8	Hole Dim.Tolerance(NPTH)	±0.05mm
		±0.002"
9	Drill Location Tolerance	±0.05mm
		±0.002"
10	V-Cut Degrees	20-90 ºC
		20DEG-90DEG
11	Min.V-Cut PCB Thickness	0.4mm
		0.016"
12	N/C Routing Tolerance	±0.1mm
		±0.004"
13	Min.Blind/Buried Via	0.15mm
		0.06"
14	Plug Hole Size	0.2mm--0.6mm
		0.008"--0.024"
15	Min.BGA PAD	0.2mm
		0.008"
16	Materials	FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB

17	Surface Finish	HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F

18	Warp & Twist	≤0.75%

19	Electrical Testing	50--300V

20	Solderability Testing	245±5ºC,3sec Wetting area least95%

21	Thermal Cycling Testing	288±5ºC,10sec,3cycles

22	Ionic Contamination Testing	Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm

23	Soldmask Adhesion Testing	260ºC+/-5, 10S,3times

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